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Agilent HFBR-57E0L/AL/P/AP Multimode Small Form Factor Pluggable Transceivers with LC connector for ATM, FDDI, Fast Ethernet and SONET OC-3/ SDH STM-1
Data Sheet
Features
* Full compliance with ATM Forum
Description The HFBR-57E0 Small Form Factor Pluggable LC transceivers provide the system designer with a product to implement a range of solutions for multimode fiber Fast Ethernet and SONET OC-3 (SDH STM-1) physical layers for ATM and other services. This transceiver operates at a nominal wavelength of 1300 nm with an LC fiber connector interface with an external connector shield (HFBR-57E0). Transmitter Section The transmitter section of the HFBR-57E0 utilizes a 1300 nm InGaAsP LED. This LED is packaged in the optical subassembly portion of the transmitter section. It is driven by a custom silicon IC which converts differential PECL logic signals, ECL referenced (shifted) to a +3.3 V supply, into an analog LED drive current.
* * *
Receiver Section The receiver section of the HFBR-57E0 utilizes an InGaAs PIN photodiode coupled to a custom silicon transimpedance preamplifier IC. It is packaged in the optical subassembly portion of the receiver. This PIN/preamplifier combination is coupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the Loss of Signal (LOS) function. The data output is differential. The data output is PECL compatible, ECL referenced (shifted) to a +3.3 V power supply. This circuit also includes a loss of signal (LOS) detection circuit which provides an open collector logic high output in the absence of a usable input optical signal. The LOS output is +3.3 V TTL.
* * * * * *
*
UNI SONET OC-3 multimode fiber physical layer specification Full compliance with the optical performance requirements of the FDDI PMD Standard Full compliance with the optical performance requirements of 100Base-FX version of IEEE802.3u Industry standard Small Form Pluggable (SFP) package LC duplex connector optical interface Operates with 62.5/125 m and 50/125 m multimode fiber Single +3.3 V power supply +3.3 V TTL LOS output Manufactured in an ISO 9001 certified facility Temperature range: HFBR-57E0L/P: 0 C to +70 C HFBR-57E0AL/AP: -40 C to +85 C Bail de-latch option
Applications * OC-3 SFP transceivers are designed for ATM LAN and WAN applications such as: ATM switches and routers SONET/SDH switch infrastructure * Multimode fiber ATM backbone links * Fast Ethernet
Loss of Signal The Loss of Signal (LOS) output indicates that the optical input signal to the receiver does not meet the minimum detectablelevel for FDDI and OC-3 compliant signals. When LOS is high it indicates loss of signal. When LOS is low it indicates normal operation. The LOS thresholds are set to indicate a definite optical fault has occurred (e.g., disconnected or broken fiber connection to receiver, failed transmitter). Module Package The transceiver meets the Small Form Pluggable (SFP) industry standard package utilizing an integral LC duplex optical interface connector. The hot-pluggable capability of the SFP package allows the module to be installed at any time - even with the host system operating and on-line. This allows for system configuration changes or maintenance without system down time. The HFBR-57E0 uses a reliable 1300 nm LED source and requires a 3.3 V dc power supply for optimal design.
Module Diagrams Figure 1 illustrates the major functional components of the HFBR-57E0. The connection diagram of the module is shown in Figure 2. Figures 5 and 7 depict the external configuration and dimensions of the module. Installation The HFBR-57E0 can be installed in or removed from any MultiSource Agreement (MSA) - compliant Small Form Pluggable port regardless of whether the host equipment is operating or not. The module is simply inserted, electrical interface first, under finger pressure. Controlled hotplugging is ensured by design and by 3-stage pin sequencing at the electrical interface. The module housing makes initial contact with the host board EMI shield mitigating potential damage due to Electro-Static Discharge (ESD). The 3-stage pin contact sequencing involves (1) Ground, (2) Power, and then (3) Signal pins, making contact with the host board surface mount connector in that order. This printed circuit board card-edge connector is depicted in Figure 2.
Serial Identification (EEPROM) The HFBR-57E0 complies with the industry standard MSA that defines the serial identification protocol. This protocol uses the 2-wire serial CMOS E2PROM protocol of the ATMEL AT24C01A or equivalent. The contents of the HFBR-57E0 serial ID memory are defined in Table 3 as specified in the SFP MSA. Functional Data I/O The HFBR-57E0 fiberoptic transceiver is designed to accept industry standard differential signals. In order to reduce the number of passive components required on the customer's board, Agilent has included the functionality of the transmitter bias resistors and coupling capacitors within the fiberoptic module. The transceiver is compatible with an "ac-coupled" configuration and is internally terminated. Figure 5 depicts the functional diagram of the HFBR-57E0.
OPTICAL INTERFACE RECEIVER
ELECTRICAL INTERFACE
RD+ (Receive Data) Light from Fiber Photodetector Amplification & Quantizattion RD- (Receive Data) Loss of Signal
TRANSMITTER TD+ (Transmit Data) Light to Fiber LED LED DRIVER TD- (Transmit Data)
TX Disable
EEPROM
MOD-DEF2 MOD-DEF1 MOD-DEF0
Figure 1. Transceiver functional diagram
2
Regulatory Compliance See Table 1 for transceiver Regulatory Compliance performance. The overall equipment design will determine the certification level. The transceiver performance is offered as a figure of merit to assist the designer. Electrostatic Discharge (ESD) There are two conditions in which immunity to ESD damage is important. Table 1 documents our immunity to both of these conditions. The first condition is during handling of the transceiver prior to insertion into the transceiver port. To protect the transceiver, it is important to use normal ESD handling precautions.
20 19 18 17 16 15 14 13 12 11 VEET TDTD+ VEET VCCT VCCR VEER RD+ RDVEER TOP OF BOARD
These precautions include using grounded wrist straps, workbenches, and floor mats in ESD controlled areas. The ESD sensitivity of the HFBR-57E0 is compatible with typical industry production environments. The second condition is static discharges to the exterior of the host equipment chassis after installation. To the extent that the duplex LC optical interface is exposed to the outside of the host equipment chassis, it may be subject to system-level ESD requirements. The ESD performance of the HFBR-57E0 exceeds typical industry standards.
Immunity Equipment hosting the HFBR57E0 modules will be subjected to radio-frequency electro magnetic fields in some environments. These transceivers have good immunity to such fields due to their shielded design. Electromagnetic Interference (EMI) Most equipment designs utilizing these high-speed transceivers from Agilent will be required to meet the requirements of FCC in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. The metal housing and shielded design of the HFBR-57E0 minimize the EMI challenge facing the host equipment designer. These transceivers provide superior EMI performance. This greatly assists the designer in the management of the overall system EMI performance.
1 2 3 4 5 6 7 8 9 10
VEET NC** Tx Disable MOD-DEF(2) MOD-DEF(1) MOD-DEF(0) NC LOS VEER VEER
** Connect to Internal Ground. Figure 2. Connection diagram of module printed circuit board.
BOTTOM OF BOARD (AS VIEWED THROUGH TOP OF BOARD)
3
Eye Safety These transceivers provide Class 1 eye safety by design. Agilent has tested the transceiver design for compliance with the requirements listed in Table 1 under normal operating conditions and under a single fault condition.
Flammability The HFBR-57E0 transceiver housing is made of metal and high strength, heat resistant, chemically resistant, and UL 94V-0 flame retardant plastic.
Shipping Container The transceiver is packaged in a shipping container designed to protect it from mechanical and ESD damage during shipment or storage.
Table 1. Regulatory Compliance
Feature
Electrostatic Discharge (ESD) to the Electrical Pins Electrostatic Discharge (ESD) to the Duplex LC Receptacle
Test Method
MIL-STD-883C
Performance
Meets Class 2 (2000 to 3999 Volts). Withstand up to 2200 V applied between electrical pins. Typically withstand at least 25 kV without damage when the LC connector receptacle is contacted by a Human Body Model probe. System margins are dependent on customer board and chassis design.
Variation of IEC 61000-4-2
Electromagnetic Interference (EMI)
FCC Class B CENELEC CEN55022 Class B (CISPR 21) VCCI Class 1 Variation of IEC 61000-4-3
Immunity
Typically shows a negligible effect from a 10 V/m field swept from 80 to 450 MHz applied to the transceiver without a chassis enclosure. Compliant per Agilent testing under single fault conditions. TUV Certification: R 72042022 UL File#: E173874
Eye Safety
AEL Class 1 EN60825-1 (+A11)
Component Recognition
Underwriters Laboratories and Canadian Standard Associations Joint Component Recognition for Information Technology Equipment Including Electrical Business Equipment
4
Transceiver Optical Power Budget versus Link Length Optical Power Budget (OPB) is the available optical power for a fiberoptic link to accommodate fiber cable loses plus losses due to in-line connectors, splices, optical switches, and to provide margin for link aging and unplanned losses due to cable plant reconfiguration or repair. Agilent LED technology has produced 1300 nm LED devices with lower aging characteristics than normally associated with these technologies in the industry. The industry convention is 1.5 db aging for 1300 nm LEDs. The 1300 nm Agilent LEDs are specified to experience less than 1 db of aging over normal commercial equipment mission life periods. Contact your Agilent sales representative for additional details.
Ordering Information The HFBR-57E0 1300 nm product is available for production orders through the Agilent Component Field Sales Offices and Authorized Distributors worldwide. For technical information regarding this product, please visit Agilent Semiconductor Products website at www.agilent.com/view/fiber. Use the quick search feature to search for this part number. You may also contact Agilent Semiconductor Products Customer Response Centre at 1-800-235-0312.
Applications Support Materials Contact your local Agilent Component Field Sales Office for information on how to obtain PCB layouts and evaluation boards for the transceivers.
200
6
180
TRANSMITTER OUTPUT OPTICAL SPECTRAL WIDTH (FWHM) - nm
1.0 160 1.5
RELATIVE INPUT OPTICAL POWER (dB)
3.0
5
4
3
140
2.0 2.5 3.0 tr/f - TRANSMITTER OUTPUT OPTICAL RISE/ FALL TIMES - ns
2
120
1
100 1260
1280
1300
1320
1340
1360
0 -3 -2 -1 0 1 2 3 EYE SAMPLING TIME POSITION (ns)
C - TRANSMITTER OUTPUT OPTICAL RISE/FALL TIMES - ns HFBR-57E0 TRANSMITTER TEST RESULTS OF C, AND tr/f ARE CORRELATED AND COMPLY WITH THE ALLOWED SPECTRAL WIDTH AS A FUNCTION OF CENTER WAVELENGTH FOR VARIOUS RISE AND FALL TIMES.
CONDITIONS: 1. TA = +25 C 2. VCC = 3.3 V dc 3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns. 4. INPUT OPTICAL POWER IS NORMALIZED TO CENTER OF DATA SYMBOL. 5. NOTE 13 AND 14 APPLY.
Figure 3. Transmitter Output Optical Spectral Width (FWHM) vs. Transmitter Output Optical Center Wavelength and Rise/Fall Times
Figure 4. Relative Input Optical Power vs. Eye Sampling Time Position
5
1 H 3.3 V 10 F 0.1 F 1 H 0.1 F
3.3 V
HFBR-57E0 4.7 K to 10 K Tx Dis 3.3 V 82 0.1 F 82
SO+ SO-
50 50
TD+ TD- TX GND
LED DRIVER & SAFETY CIRCUITRY 0.1 F
130 VCCR 130 W 3.3 V 130
PROTOCOL IC
SerDes
4.7 K to 10 K 10 F SI+ SI- 50 50
0.1 F RD+ RD- Rx_LOS RX GND MOD_DEF2 MOD_DEF1 MOD_DEF0
130 0.1 F
Rx_LOS
0.1 F
82
AMPLIFICATION & QUANTIZATION
82
GPIO(X) GPIO(X) GP14 4.7 K to 10 K 4.7 K to 10 K
EEPROM
4.7 K to 10 K
3.3 V
Figure 5. Recommended application configuration
1 H VCCT 0.1 F 1 H VCCR 0.1 F 10 F 0.1 F 10 F 3.3 V
SFP MODULE
HOST BOARD
Note: Inductors must have less than 1 ohm series resistance per MSA. Figure 6. MSA required power supply filter
6
Table 2. Pin Description
Pin
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Name
VEET NC Tx Disable MOD-DEF2 MOD-DEF1 MOD-DEF0 NC LOS VEER VEER VEER RDRD+ VEER VCCR VCCT VEET TD+ TDVEET
Function/Description
Transmitter Ground NC Transmitter Disable- Module disables on high or open Module Definition 2 - Two Wire Serial ID Interface Module Definition 1 - Two Wire Serial ID Interface Module Definition 0 - grounded in module NC Loss of Signal - high indicates loss of signal Receiver Ground Receiver Ground Receiver Ground Inverse Received Data Out Received Data Out Receiver Ground Receiver Power -3.3 V 10% Transmitter Power -3.3 V 10% Transmitter Ground Transmitter Data In Inverse Transmitter Data In Transmitter Ground
MSA Notes
1
2 2 2
3
4 4
5 5
6 6
Notes: 1. Pin 2 connected to internal ground. 2. Mod-Def 0, 1, 2. are the module definition pins. They should be pulled up with a 4.7 K - 10 KW resistor on the host board to a supply less than VCCT +0.3 V or VCCR +0.3 V. Mod-Def 0 is grounded by the module to indicate that the module is present. Mod-Def 1 is clock line of two wire serial interface for optional serial ID. Mod-Def 2 is data line of two wire serial interface for optional serial ID. 3. LOS (Loss of Signal) is an open collector/drain output which should be pulled up externally with a 4.7 - 10 KW resistor on the host board to a supply < V CC T, R +0.3 V. When high, this output indicates the received optical power is below the worst case receiver sensitivity (as defined by the standard in use). Low indicates normal operation. In the low state, the output will be pulled to <0.8 V. 4. RD-/+: These are the differential receiver outputs. They are ac coupled 100 W differential lines which should be terminated with 100 W differential at the SERDES. The ac coupling is done inside the module and is thus not required on the host board. The voltage swing on these lines will be between 400 and 2000 mV differential (200 - 1000 mV single ended) when properly terminated. 5. VCCR and VCCT are the receiver and transmitter power supplies. They are defined as 2.97 - 3.63 V at the SFP connector pin. The maximum supply current is 230 mA and the associated in-rush current will typically be no more than 30 mA above steady state after 500 nanoseconds. 6. TD-/+: These are the differential transmitter inputs. They are ac coupled differential lines with 100 W differential termination inside the module. The ac coupling is done inside the module and is thus not required on the host board. The inputs will accept differential swings of 500 - 2000 mV (250 - 1200 mV single ended), though it is recommended that values between 500 and 1200 mV differential (250 - 600 mV single ended) be used for best EMI performance. These levels are compatible with CML and LVPECL voltage swings.
7
Table 3. EEPROM Serial ID Memory Contents
Add
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33
Hex
03 04 07 00 00 01 Note 6 20 Note 6 00 00 00 00 03 Note 7 02 Note 8 00 00 00 C8 C8 00 00 41 47 49 4C 45 4E 54 20 20 20 20 20 20 20
ASCII
Add
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59
Hex
48 46 42 52 2D 35 37 45 30 41 Note 4 50 Note 4 20 Note 4 20 Note 4 20 Note 4 20 20 30 30 30 30 05 1E 00 Note 3 00 12 00 00
ASCII
H F B R 5 7 E 0 A P
Add
68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83
Hex
Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 2 Note 2 Note 2 Note 2 Note 2 Note 2 Note 2 Note 2 00 00 00 Note 3
ASCII
Add
96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127
Hex
Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5 Note 5
ASCII
0 0 0 0
84 85 86 87 88 89 90 91 92 93 94 95
A G I L E N T
60 61 62 63 64 65 66 67
8
Table 3. EEPROM Serial ID Memory Contents (continued)
Add
34 35 36 37 38 39
Hex
20 20 00 00 30 D3
ASCII
Add
Hex
ASCII
Add
Hex
ASCII
Add
Hex
ASCII
Notes: 1. Addresses 68 - 83 specify a unique identifier. 2. Addresses 84 - 91 specify the date code. 3. Addresses 63 and 95 are check sums. Address 63 is the check sum for bytes 0 - 62 and address 95 is the check sum for bytes 64 - 94. 4. Part number options L, P, AL, AP, etc. Example: for "AP" option, hexes in addresses 49, 50, 51, 52 and 52 will be 41, 50, 20, 20 and 20 respectively. 5. Addresses 96-127 are vendor specific data. 6. Addresses 5 and 6 specify compliance code. Address 5 with Hex 01 for OC-3 and address 6 with Hex 20 for Fast Ethernet. 7. Address 11 specifies encoding code. Hex 03 for OC-3 and Hex 02 for Fast Ethernet. 8. Address 12 specifies bit rate. Hex 02 for OC-3 and Hex 01 for Fast Ethernet.
9
AGILENT HFBR-57E0xx YYWW Country of Origin Tcase Reference Point 13.80.1 [0.5410.004] DEVICE SHOWN WITH DUST CAP AND BAIL WIRE DELATCH 2.60 [0.10]
13.40.1 [0.5280.004]
55.20.2 [2.170.01]
6.250.05 [0.2460.002] 13.00.2 [0.5120.008] TX RX AREA FOR PROCESS PLUG
FRONT EDGE OF SFP TRANSCEIVER CAGE
0.7MAX. UNCOMPRESSED [0.028] 8.50.1 [0.3350.004]
DIMENSIONS ARE IN MILLIMETERS (INCHES) 6.6 [0.261] 13.50 [0.53]
14.8MAX. UNCOMPRESSED [0.583]
Figure 7. Module Drawing
10
Y
X 34.5 10 3x 10x 1.05 0.01 0.1 L X A S 1 B 7.2 2.5 2.5 7.1 0.85 0.05 0.1 S X Y A 1 3.68
16.25 MIN. PITCH PCB EDGE
5.68 8.58 11.08 16.25 REF . 14.25
PIN 1
20
2x 1.7
8.48 9.6 11.93
10
11
4.8
SEE DET AIL 1 2.0 11x 26.8 3 41.3 42.3 10 3x 5 11x 2.0 9x 0.95 0.05 0.1 L X A S 2
5 3.2 0.9 20x 0.5 0.03 0.06 L A S B S
PIN 1
20
LEGEND 10.53 11.93 1. PADS AND VIAS ARE CHASSIS GROUND 2. THR OUGH HOLES, PLATING OPTIONAL
10.93 9.6 0.8 TYP .
11 10
3. HATCHED AREA DENOTES COMPONENT AND TRACE KEEPOUT (EXCEPT CHASSIS GROUND) 2 0.005 TYP . 0.06 L A S B S DET AIL 1 4. AREA DENOTES COMPONENT KEEPOUT (TRACES ALLOWED) DIMENSIONS ARE IN MILLIMETERS
4 2x 1.55 0.05 0.1 L A S B S
Figure 8. SFP host board mechanical layout
11
3.50.3 [.14.01] PCB 41.730.5 [1.64.02]
1.70.9 [.07.04]
BEZEL
AREA FOR PROCESS PLUG
15MAX .59
Tcase REFERENCE POINT CAGE ASSEMBLY 15.250.1 [.600.004] 12.4REF .49 10.40.1 [.410.004]
9.8MAX .39
1.15REF .05 BELOW PCB
10REF .39 TO PCB 0.40.1 [.020.004] BELOW PCB MSA-SPECIFIED BEZEL 16.250.1MIN PITCH [.640.004]
DIMENSIONS ARE IN MILLIMETERS [INCHES].
Figure 9. SFP Assembly Drawing
12
Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Symbol Minimum Typical Maximum Units Notes
Storage Temperature Lead Soldering Temperature Lead Soldering Time Supply Voltage Data Input Voltage Differential Input Voltage (p-p) Output Current TS TSOLD tSOLD VCC VI VD IO -0.5 -0.5 -40 +100 +260 10 3.63 VCC 2.0 50 C C sec V V V mA 1
Recommended Operating Conditions Parameter
Case Operating Temperature HFBR-57E0L/LP HFBR-57E0AL/AP Supply Voltage
Symbol
TC TC VCC
Minimum
0 -40 2.97 0.4
Typical
Maximum
+70 +85 3.63 2.0
Units
C C V V W V
Notes
3.3
Data Input: Transmitter Differential Input Voltage VI (TD+/-) Data and Loss of Signal Output Load Differential Input Voltage (p-p) RL VD
50 0.800
2
Transmitter Electrical Characteristics HFBR-57E0L/LP (TC = 0 C to +70 C, VCC = 2.97 V to 3.63 V) HFBR-57E0AL/AP (TC = -40 C to +85 C, VCC = 2.97 V to 3.63 V)
Parameter
Su p p ly Cu rren t Po wer Dissip a tio n Tra n smitter Disa b le (TX Disa b le) Tra n smitter Disa b le (TX Disa b le)
Symbol
I CC PDISS VIH VIL
Minimum
Typical
165 0.55
Maximum
210 0.80 3.5 0.8
Units
mA W V V
Notes
3 5a
2.0 0
Receiver Electrical Characteristics HFBR-57E0L/LP (TC = 0 C to +70 C, VCC = 2.97 V to 3.63 V) HFBR-57E0AL/AP (TC = -40 C to +85 C, VCC = 2.97 V to 3.63 V)
Parameter
Supply Current Power Dissipation
Symbol
ICC PDISS
Minimum
Typical
95 0.35
Maximum
150 0.55 2.0 2.2 2.2 0.8
Units
mA W V ns ns V V
Notes
4 5b 6 7 7 6 6
Data Output: Receiver Differential Output Voltage VO (RD+/-) Data Output Rise Time Data Output Fall Time Loss of Signal Output Voltage - Low Loss of Signal Output Voltage - High Power Supply Noise Rejection tr tf LOSVOL LOSVOH PSNR
0.4 0.35 0.35
2.0 50
mV
13
Transmitter Optical Characteristics HFBR-57E0L/LP(TC = 0 C to +70 C, VCC = 2.97 V to 3.63 V) HFBR-57E0AL/AP (TC = -40 C to +85 C, VCC = 2.97 V to 3.63 V)
Parameter
Output Optical Power BOL 62.5/125 m, NA = 0.275 Fiber EOL Output Optical Power BOL 50/125 m, NA = 0.20 Fiber EOL Center Wavelength Spectral Width - FWHM Spectral Width - RMS Optical Rise Time Optical Fall Time Systematic Jitter Contributed by the Transmitter OC-3 FE Random Jitter Contributed by the Transmitter OC-3 FE SJ 0.04 0.02 1.2 0.6 ns p-p 11a 11b
Symbol
PO PO lC Dl tr tf
Minimum
-19 -20 -22.5 -23.5 1270
Typical
-15.7
Maximum
-14 -14
Units
dBm avg dBm avg nm nm
Notes
8 8 21, Figure 3 9, 21 Figure 3 10, 21 Figure 3 10, 21 Figure 3
1308 147 63 1.2 2.0
1380
0.6 0.6
3.0 3.0
ns ns
RJ
0 0
0.52 0.69
ns p-p
12a 12b
Receiver Optical and Electrical Characteristics HFBR-57E0L /LP(TC = 0 C to +70 C, VCC = 2.97 V to 3.63 V) HFBR-57E0AL/AP (TC = -40 C to +85 C, VCC = 2.97 V to 3.63 V)
Parameter
Input Optical Power minimum at Window Edge OC-3 FE Input Optical Power at Eye Center OC-3 FE Input Optical Power Maximum OC-3 FE Operating Wavelength Systematic Jitter Contributed by the Receiver OC-3 FE Random Jitter Contributed by the Receiver OC-3 FE Loss of Signal - Asserted OC-3 FE Loss of Signal - Deasserted Loss of Signal - Hysteresis Loss of Signal Assert Time (off to on) Loss of Signal Deassert Time (on to off) PIN MIN (C)
Symbol
PIN MIN (W)
Minimum
Typical
Maximum
-30 -31 -31 -31.8
Units
dBm avg
Notes
13a, Figure 4 13b 14a, Figure 4 14b 13a 13b
dBm avg
PIN MAX l
-14 -14 1270
dBm avg 1380 nm
SJ
0.2
1.2 1.0 1.91 2.14 -31 -33
ns p-p
15a 15b 16a 16b 17 18
RJ
1 1 PD + 1.5 dB -45 1.5 0 0 2 5
ns p-p
PA PD P A - PD
dBm avg dBm avg dB
100 350
s s
19 20
14
Notes: 1. This is the maximum voltage that can be applied across the Differential Transmitter Data Inputs to prevent damage to the input ESD protection circuit. 2. The data outputs are terminated with 50W . The Loss of Signal output is terminated with 50 W connected to a pull-up resistor of 4.7 KW tied to V CC. 3. The power supply current needed to operate the transmitter is provided to differential ECL circuitry. This circuitry maintains a nearly constant current flow from the power supply. Constant current operation helps to prevent unwanted electrical noise from being generated and conducted or emitted to neighboring circuitry. 4. This is the receiver supply current measured in mA. 5a. The power dissipation of the transmitter is calculated as the sum of the products of supply voltage and current. 5b. The power dissipation of the receiver is calculated as the sum of the products of supply voltage and currents, minus the sum of the products of the output voltages and currents. 6. Differential Output Voltage is internally ac coupled. The Loss of Signal low and high voltages are measured with load condition as mentioned in note 2. 7. The data output rise and fall times are measured between 20% and 80% levels. 8. These optical power values are measured with the following conditions: The Beginning of Life (BOL) to the End of Life (EOL) optical power degradation is typically 1.5 dB per the industry convention for long wavelength LEDs. The actual degradation observed in Agilent's 1300 nm LED products is < 1 dB, as specified in this data sheet. Over the specified operating voltage and temperature ranges. With 25 MBd (12.5 MHz square-wave), input signal. At the end of one meter of noted optical fiber with cladding modes removed. The average power value can be converted to a peak power value by adding 3 dB. Higher output optical power transmitters are available on special request. Please consult with your local Agilent sales representative for further details. 9. The relationship between Full Width Half Maximum and RMS values for Spectral Width is derived from the assumption of a Gaussian shaped spectrum which results in a 2.35 X RMS = FWHM relationship. 10. The optical rise and fall times are measured from 10% to 90% when the transmitter is driven by a 25 MBd (12.5 MHz square-wave) input signal. The ANSI T1E1.2 committee has designated the possibility of defining an eye pattern mask for the transmitter optical output as an
item for further study. Agilent will incorporate this requirement into the specifications for these products if it is defined. The HFBR-57E0 products typically comply with the template requirements of CCITT (now ITU-T) G.957 Section 3.2.5, Figure 2 for the STM- 1 rate, excluding the optical receiver filter normally associated with single mode fiber measurements which is the likely source for the ANSI T1E1.2 committee to follow in this matter. 11a. Systematic Jitter contributed by the transmitter is defined as the combination of Duty Cycle Distortion and Data Dependent Jitter. Systematic Jitter is measured at 50% threshold using a 155.52 MBd (77.5 MHz square-wave), 223- 1 psuedorandom data pattern input signal. 11b. Data Dependent Jitter contributed by the transmitter is specified with the FDDI test pattern described in FDDI PMD Annex A.5. See Application Information - Transceiver Jitter Performance Section of this data sheet for further details. 12a. Random Jitter contributed by the transmitter is specified with a 155.52 MBd (77.5 MHz square-wave) input signal. 12b. Random Jitter contributed by the transmitter is specified with an IDLE Line State, 125 MBd (62.5 MHz square-wave) input signal. See Application Information Transceiver Jitter Performance Section of this data sheet for further details. 13a. This specification is intended to indicate the performance of the receiver section of the transceiver when Input Optical Power signal characteristics are present per the following definitions. The Input Optical Power dynamic range from the minimum level (with a window time-width) to the maximum level is the range over which the receiver is guaranteed to provide output data with a Bit Error Rate (BER) At better than or equal to 1 x 10-10. the Beginning of Life (BOL) over the specified operating temperature and voltage ranges input is a 155.52 MBd, 2231 PRBS data pattern with 72 "1" s and 72 "0"s inserted per the CCITT (now ITU-T) recommendation G.958 Appendix I. Receiver data window time-width is 1.23 ns or greater for the clock recovery circuit to operate in. The actual test data window time-width is set to simulate the effect of worst case optical input jitter based on the transmitter jitter values from the specification tables. The test window time-width is HFBR-57E0 3.32 ns. Transmitter operating with a 155.52 MBd, 77.5 MHz square-wave, input signal to simulate any cross-talk present between the transmitter and receiver sections of the transceiver. 13b. This specification is intended to indicate the performance of the receiver section of the transceiver when Input Optical Power
signal characteristics are present per the following definitions. The Input Optical Power dynamic range from the minimum level (with a window time-width) to the maximum level is the range over which the receiver is guaranteed to provide output data with a Bit Error Rate (BER) better than or equal to 2.5 x 10-10. * At the Beginning of Life (BOL) * Over the specified operating temperature and voltage ranges * Input symbol pattern is the FDDI test pattern defined in FDDI PMD Annex A.5 with 4B/5B NRZI encoded data that contains a duty cycle base-line wander effect of 50 kHz. This sequence causes a near worst case condition for intersymbol interference. * Receiver data window time-width is 2.13 ns or greater and centered at midsymbol. This worst case window timewidth is the minimum allowed eye-opening presented to the FDDI PHY PM_Data indication input (PHY input) per the example in FDDI PMD Annex E. This minimum window time-width of 2.13 ns is based upon the worst case FDDI PMD Active Input Interface optical conditions for peak-to-peak DCD (1.0 ns), DDJ (1.2 ns) and RJ (0.76 ns) presented to the receiver. To test a receiver with the worst case FDDI PMD Active Input jitter condition requires exacting control over DCD, DDJ and RJ jitter components that is difficult to implement with production test equipment. The receiver can be equivalently tested to the worst case FDDI PMD input jitter conditions and meet the minimum output data window time-width of 2.13 ns. This is accomplished by using a nearly ideal input optical signal (no DCD, insignificant DDJ and RJ) and measuring for a wider window time-width of 4.6 ns. This is possible due to the cumulative effect of jitter components through their superposition (DCD and DDJ are directly additive and RJ components are rms additive). Specifically, when a nearly ideal input optical test signal is used and the maximum receiver peak-to-peak jitter contributions of DCD (0.4 ns), DDJ (1.0 ns), and RJ (2.14 ns) exist, the minimum window time-width becomes 8.0 ns -0.4 ns - 1.0 ns - 2.14 ns = 4.46 ns, or conservatively 4.6 ns. This wider window time-width of 4.6 ns guarantees the FDDI PMD Annex E minimum window timewidth of 2.13 ns under worst case input jitter conditions to the Agilent receiver. * Transmitter operating with an IDLE Line State pattern, 125 MBd (62.5 MHz square-wave), input signal to simulate any cross-talk present between the transmitter and receiver sections of the transceiver.
15
14a. All conditions of Note 13a apply except that the measurement is made at the center of the symbol with no window time- width. 14b. All conditions of Note 13b apply except that the measurement is made at the center of the symbol with no window time-width. 15a. Systematic Jitter contributed by the receiver is defined as the combination of Duty Cycle Distortion and Data Dependent Jitter. Systematic Jitter is measured at 50% threshold using a 155.52 MBd (77.5 MHz square- wave), 223-1 psuedorandom data pattern input signal. 15b. Data Dependent Jitter contributed by the receiver is specified with the FDDI DDJ test pattern described in the FDDI PMD Annex A.5. The input optical power level is -20 dBm average. See Application Information - Transceiver Jitter Section for further information. 16a. Random Jitter contributed by the receiver is specified with a 155.52 MBd (77.5 MHz square- wave) input signal. 16b. Random Jitter contributed by the receiver is specified with an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. The input optical power level is at maximum "PIN MIN (W)". See Application Information - Transceiver Jitter Section for further information. 17. This value is measured during the transition from low to high levels of input optical power. 18. This value is measured during the transition from high to low levels of input optical power. At Loss of Signal Deassert, the receiver outputs Data Out and Data Out Bar go to steady PECL levels High and Low respectively. 19. The Loss of Signal output shall be asserted within 100 s after a step increase of the Input Optical Power. 20. Loss of Signal output shall be de-asserted within 100 s after a step decrease in the Input Optical Power. At Loss of Signal Deassert, the receiver outputs Data Out and Data Out Bar go to steady PECL levels High and Low respectively. 21. The HFBR-57E0 transceiver complies with the requirements for the trade-offs between center wavelength, spectral width, and rise/fall times shown in Figure 3. This figure is derived from the FDDI PMD standard (ISO/IEC 9314-3 : 1990 and ANSI X3.166 - 1990) per the description in ANSI T1E1.2 Revision 3. The interpretation of this figure is that values of Center Wavelength and Spectral Width must lie along the appropriate Optical Rise/Fall Time curve.
Ordering Information 1300 nm LED (Operating Case Temperature 0 to +70 C) HFBR-57E0L Standard de-latch HFBR-57E0P Bail de-latch 1300 nm LED (Operating Case Temperature -40 C to +85 C) HFBR-57E0AL Standard de-latch HFBR-57E0AP Bail de-latch
EEPROM contents and/or label options HFBR-57E0L-xxx Standard de-latch, 0 to +70C HFBR-57E0P-xxx Bail de-latch, 0 to +70C HFBR-57E0AL-xxx Standard de-latch, -40C to +85C HFBR-57E0AP-xxx Bail de-latch, -40C to +85C Where "xxx" is customer specific.
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For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. October 22, 2004 5989-1756EN

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